TECHNICAL SPECIFICATIONS
| Model | JLO-CL3030 |
| Max. Depaneling Size | 300mm (X) * 300mm (Y) |
| Cuttable PCB Thickness | <1.5mm |
| X/Y Axis Movement Resolution | 0.1μm |
| Galvanometer Resolution | 16 bit |
| Repeat Positioning Accuracy | ≤ ±1μm |
| Cutting Accuracy | ±20μm |
| Max. Laser Output Power | 20W |
| Supported Data Formats | Gerber, DXF |
| Laser Wavelength | 355nm, Diode-Pumped Solid-State Laser (DPSS Laser) |
| Laser Pulse Frequency | 70kHz to 150kHz |
| Laser Source | 20W / 30W / 60W Optional |
| Integrated Operation Software | Smart Laser |
| Laser Power Monitoring System | Low-Level Monitoring |
| Positioning Method | Automatic Camera Alignment |
| Cooling Method | Chiller Cooling (Refrigeration) |
| Flexible PCB Adsorption Method | Vacuum Adsorption (Optional) |
| Main Unit Power Supply Specs | 220V, 50Hz, 3.5kW |
| Chiller & Dust Collector Power Rating | 2.3kW+2KW |
| Dust Extraction Method | Bottom-Following Suction (Standard) |
| MES Integration | MES Captured CSV Text Format (Standard), Barcode Scanner (Optional) |
| Machine Dimensions (W*H*D) | 1375x1325x1600mm |
| Machine Weight | 1200kg |
EQUIPMENT PERFORMANCE
Adopting non-contact laser vaporization cutting without mechanical stress, it will not cause physical damage to fragile components such as flexible printed circuits (FPC) and 0201 packaged micro-components, greatly improving product yield.
The heat-affected zone is only about 0.1mm. The cutting edge is smooth without burrs and delamination. Workpieces can directly proceed to the next welding process without extra grinding, effectively saving process costs.
It is capable of cutting various materials including FR4 rigid boards, FPC flexible boards, rigid-flex boards, SiC power modules and ultra-thin substrates, meeting depaneling demands in consumer electronics, new energy vehicles, medical electronics, aerospace and other fields.
No physical cutters or molds replacement is required. It can cut any complex contours simply via software programming. Ideal for processing special-shaped boards and high-density boards. It supports rapid model switching for multi-variety and small-batch production, effectively shortening the production cycle.