JELIO's research and development is built on a single principle: the engineers who write the control algorithms are the same people who assemble and test the hardware. This end-to-end capability eliminates the disconnect between software promise and machine performance.
Our team covers software architecture, motion control, mechanical design, and system integration. Every platform is developed as a unified system, not a collection of outsourced components. The result is depaneling equipment that performs exactly as designed, from the first cut to the ten-thousandth.
Core innovations including burr-free depaneling technology that reduces post-process cleaning and improves long-term board reliability. These patents protect the fundamental methods that differentiate JELIO's cutting performance.
Structural optimizations for mechanical stability, tooling interchangeability, and operator safety. These practical innovations ensure machines run consistently in demanding production environments with minimal maintenance.
Proprietary control systems, motion algorithms, and human-machine interfaces developed specifically for depaneling processes. Software is not purchased from third parties. It is written, tested, and refined by the same team that designed the hardware.
High-speed spindle milling with micron-level accuracy Dual-station router systems achieve ±0.02mm repeatability at 60,000rpm, with automatic tool change and multi-Mark CCD vision compensation for stress-free PCB separation.
Milling cutter + saw blade dual-process on single platform Combines flexible contour routing (L/U-shape, arc, circle) with high-speed straight-line saw cutting, enabling single-machine processing of diverse PCB materials and depaneling requirements.
Multi-Mark recognition with real-time path correction 1.3MP CCD camera supports up to 4 Mark scans with automatic offset trajectory correction, rotation compensation, and blade-angle alignment to eliminate board-handling errors and prevent cutting defects.
Non-contact UV laser processing for fragile substrates 355nm DPSS laser with 0.1μm XY resolution and ±20μm cutting accuracy, zero mechanical stress on FPC/0201 components, heat-affected zone <0.1mm for burr-free, delamination-free edges.
JELIO's research and development team includes software engineers, mechanical designers, control system specialists, and application engineers. The team works in a dedicated facility equipped with precision machining centers, testing stations, and prototype assembly areas.
Every new platform begins with customer requirements, not market speculation. Prototypes are tested with actual customer boards before production release. Design changes are driven by field performance data, not theoretical models.
Router / Milling DepanelingGuillotine DepanelingLaser DepanelingIntegrated SystemsPeripheral Equipment
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Office HeadquartersNo. 5 Datong Road, High-Tech Zone
Suzhou, Jiangsu 215000, China
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